JPH0469834B2 - - Google Patents

Info

Publication number
JPH0469834B2
JPH0469834B2 JP11888686A JP11888686A JPH0469834B2 JP H0469834 B2 JPH0469834 B2 JP H0469834B2 JP 11888686 A JP11888686 A JP 11888686A JP 11888686 A JP11888686 A JP 11888686A JP H0469834 B2 JPH0469834 B2 JP H0469834B2
Authority
JP
Japan
Prior art keywords
electronic component
wiring board
component mounting
antistatic agent
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11888686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62274793A (ja
Inventor
Yasuo Hatori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP61118886A priority Critical patent/JPS62274793A/ja
Publication of JPS62274793A publication Critical patent/JPS62274793A/ja
Publication of JPH0469834B2 publication Critical patent/JPH0469834B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP61118886A 1986-05-23 1986-05-23 電子部品実装配線基板 Granted JPS62274793A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61118886A JPS62274793A (ja) 1986-05-23 1986-05-23 電子部品実装配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61118886A JPS62274793A (ja) 1986-05-23 1986-05-23 電子部品実装配線基板

Publications (2)

Publication Number Publication Date
JPS62274793A JPS62274793A (ja) 1987-11-28
JPH0469834B2 true JPH0469834B2 (en]) 1992-11-09

Family

ID=14747575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61118886A Granted JPS62274793A (ja) 1986-05-23 1986-05-23 電子部品実装配線基板

Country Status (1)

Country Link
JP (1) JPS62274793A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014024428A (ja) * 2012-07-26 2014-02-06 Mitsubishi Cable Ind Ltd 警告表示灯

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014024428A (ja) * 2012-07-26 2014-02-06 Mitsubishi Cable Ind Ltd 警告表示灯

Also Published As

Publication number Publication date
JPS62274793A (ja) 1987-11-28

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